Albany, New York, May 26 , 2017: According to Market Research Hub’s market research report, the global semiconductor assembly equipment market will grow at a steady rate and post a CAGR of close to 4% during the forecast period. The market is witnessing a high adoption of advanced packaging techniques including TSV, 2.5D and 3D IC, stacked die packaging, and microelectromechanical system packaging, which will fuel the demand for semiconductor assembly equipment such as polymer adhesive wafer bonding equipment. Since these packaging techniques involve the bonding of two substrates using a polymer, they highly rely on polymer adhesive wafer bonding equipment, which in turn, will stimulate the growth of the semiconductor assembly equipment market. 3D packaging is considered as the future of the semiconductor packaging and assembly industry and it has been observed that the polymer adhesive wafer bonding equipment highly supports 3D packaging. Consequently, the demand for polymer adhesive wafer bonding equipment will increase and the production facilities of semiconductor device manufacturers will also improve.
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In terms of geography, APAC dominated the semiconductor assembly equipment market during 2016 and will continue to dominate the market until the end of 2021. Factors such as the presence of several major OSATs such as ASE Group and STATS ChipPAC and the rising investments to revamp production lines will create the demand for new assembly equipment. Furthermore, the presence of semiconductor equipment manufacturing hubs such as Taiwan and China will also propel the demand for assembly and packaging equipment in this region.
Competitive landscape and key vendors
The semiconductor assembly equipment market has many players and appears to be competitive and fragmented. A large number of vendors are increasingly focusing on improving assembly technologies by investing heavily in research and developmental activities. IDMs and OSATs are entering joint ventures with new and small vendors or acquiring these vendors to overcome market barriers such as market fragmentation and high investments. Consequently, small companies will benefit with an increased capacity utilization and strong market position.
Key vendors in this market are –
ASM Pacific Technology
Kulicke & Soffa Industries
Palomar Technologies
Tokyo Electron
Tokyo Seimitsu
Other prominent vendors in the market include Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.
Segmentation by type and analysis of the semiconductor assembly equipment market
Die bonding equipment
Inspection and dicing equipment
Packaging equipment
Wire bonding equipment
Plating equipment
The semiconductor assembly equipment market by die bonding equipment contributed to the maximum market shares during 2016 and the segment will continue its dominance during the estimated period as well. The growing demand for semiconductor chips from various end-user industries including energy, power, green cars, automobile, telecommunication, LED lighting, military, aerospace, and defense, and robotics, will positively influence the growth potential of this market segments.
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Segmentation by end-user and analysis of the semiconductor assembly equipment market
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and testing (OSATs)
The semiconductor assembly equipment market by OSATs dominated the market during 2016. The segment includes various players that are involved in packaging, assembly, and testing. The growth of the segment is determined by the overall growth of the semiconductor industry and the rising price of packaging, assembly, and testing equipment. According to this market research and analysis, this segment will continue to dominate the market throughout the forecast period.
Key questions answered in the report include
What will the market size and the growth rate be in 2021?
What are the key factors driving the global semiconductor assembly equipment market?
What are the key market trends impacting the growth of the global semiconductor assembly equipment market?
What are the challenges to market growth?
Who are the key vendors in the global semiconductor assembly equipment market?
What are the market opportunities and threats faced by the vendors in the global semiconductor assembly equipment market?
What are the trending factors influencing the market shares of the Americas, APAC, and EMEA?
What are the key outcomes of the five forces analysis of the global semiconductor assembly equipment market?
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